光纤光栅传感器的应力补偿及温度增敏封装
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TN253

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Study on Encapsulating Technique and Strain Sensing Characteristic of FBG Temperature Sensor
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    摘要:

    针对光纤光栅(FBG)温度传感器的交叉敏感问题,提出了一种FBG温度传感器的Al盒封装工艺,并对其温度和应力特性进行了理论分析和实验研究。研究表明,该封装有效地减小了FBG的应变灵敏性,并将温度灵敏度提高到裸FBG的1.8倍。

    Abstract:

    Considering the bare optical fiber Bragg grating(FBG) being fragility,an Al box encapsulating technique for FBG temperature sensor was developed.The encapsulation was also in expectatio to minimize the strain sensibility of the encapsulated FBG temperature sensor.The temperature and strain sensing characteristics of the encapsulated FBG and the bare FBG were theoretically and experimentally studied.The experimental comparison results of encapsulated FBG and bare FBG indicated that the strain sensing property of FBG was much less than bare FBG,and the temperature sensing property of encapsulated FBG was 1.8 times as much as that of bare FBG.

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胡家艳,江山.光纤光栅传感器的应力补偿及温度增敏封装[J].光电子激光,2006,(3):311~313

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  • 收稿日期:2005-06-25
  • 最后修改日期:2005-10-23
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