In order to meet the need of power LED flexible packaging,the flexible structure of LED is proposed based on surface mounted device(SMD) packaging.Each layer of the flexible structure is optimized,and the heat distribution is simulated using the finite element analysis(FEA) method.Thermal characteristics of several flexible packaging structures are compared with those of the traditional LED structure.The stress developed in LED chips as a result of bending is analyzed.The results show that the flexible packaging structure with metal copper foil substrate has good thermal stability.Cu/ultra-thin glass composite substrate instead of Cu substrate makes only a little difference in heat disputation but effectively reduces the stress by up to 2.5 times.Power LED flexible packaging presents a great application potential because of its flexibility and thermal stability compared with the traditional LED packaging.