Preparation of large area uniform and flat nanometer AlN thin films
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摘要:
采用射频磁控溅射法,通过优化沉积工艺,在n型 (100)Si片上制备出 (100)择优取向表面粗糙度均匀的氮化铝(AlN)薄膜。当溅射功率为 120W和N2∶Ar=12∶8时,制备的AlN薄膜的结晶性最好,101.6 mm AlN薄膜样 品的表面粗糙度为3.31~3.03nm,平均值为3.17nm。研究结果表明:射频磁控溅射能量 和N2浓度是实现大面积、均匀平坦、纳米级AlN薄膜的重要制备工艺参数。
Abstract:
The preparation of large-area uniform and flat nanometer AlN film is of great significance for the manufacture of high-performance surface acoustic wave (SAW ) device.AlN thin films with preferential orientation (100) and uniform surface roughness have bee n deposited on Si (100) substrates by RF magnetron sputtering and the deposition process is opt imized.The results show that when the sputtering power is 120W,N2:Ar=12∶8,the crystalline of AlN thi n film is the best and the surface roughness of (101.6mm)AlN thin film is from 3.03nm to 3.31nm,and t he average of surface roughness is 3.17nm.The results also show that the RF mag netron sputtering power and the nitrogen concentration are the important parameters for the preparation of l arge-area uniform and flat nanometer AlN films.